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US 12,014,998 B2Granted
Semiconductor devices comprising a radar semiconductor chip and associated production methods
AssigneeInfineon Technologies AG
InventorsErnst Seler, Markus Josef Lang, Maciej Wojnowski
Life of this patent
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Abstract
A semiconductor device comprises a substrate having a first surface and a second surface opposite the first surface, at least one connection element arranged on the first surface of the substrate to electrically and mechanically connect the substrate to a printed circuit board, and a radar semiconductor chip arranged on the first surface of the substrate.
Claims20
A semiconductor device, comprising:
- a substrate having a first surface and a second surface opposite the first surface;
- a connection element, arranged on the first surface of the substrate, connecting the substrate to a printed circuit board;
- a radar semiconductor chip arranged on the first surface of the substrate;
- and
- a dielectric lens, arranged over the second surface of the substrate, configured to focus signals transmitted or received by the semiconductor device,
- wherein the dielectric lens and the printed circuit board form a cavity completly enclosing the substrate, the connection element, and the radar semiconductor chip.
3 more elements
A method for producing a semiconductor device, wherein the method comprises:
- arranging a connection element on a first surface of a substrate, wherein the connection element connects the substrate to a printed circuit board;
- arranging a radar semiconductor chip on the first surface of the substrate;
- and
- arranging a dielectric lens over a second surface of the substrate, wherein the dielectric lens is configured to focus signals transmitted or received by the semiconductor device,
- wherein the dielectric lens and the printed circuit board form a cavity completely enclosing the substrate, the connection element, and the radar semiconductor chip.
2 more elements
A semiconductor device, comprising:
- a substrate having a first surface and a second surface opposite the first surface;
- a connection element, arranged on the first surface of the substrate, connecting the substrate to a printed circuit board;
- and
- a dielectric lens, arranged over the second surface of the substrate, configured to focus signals transmitted or received by the semiconductor device,
- wherein the dielectric lens and the printed circuit board form a cavity completly enclosing the substrate and the connection element.
2 more elements
Dependencies are inferred from the claim text.