Composite interposer structure and method of providing same

A method comprising:

• forming a first insulator structure and first interconnects therein, comprising bonding a chiplet to a substrate which comprises a glass;
• and
• forming on the substrate a second insulator structure and second interconnects therein, wherein respective inorganic dielectrics of the first insulator structure and the second insulator structure adjoin each other at a material interface;
• wherein first contacts of an interposer, the first contacts to couple the interposer to a first IC chip, are in an arrangement which spans the material interface at a first side of the interposer, wherein the interposer comprises the substrate, the first insulator structure, the second insulator structure, the first interconnects, and the second interconnects;
• wherein second contacts of the interposer, the second contacts to couple the interposer to a second IC chip, are at a first surface of the first insulator structure, and are coupled to respective ones of the first contacts via the first interconnects;
• and
• wherein third contacts of the interposer, the third contacts at a second side of the interposer opposite the first side, are coupled to respective ones of the first contacts via the second interconnects.

A system comprising:

• an interposer comprising:
• a substrate comprising a glass;
• a first insulator structure and first interconnects therein;
• and
• a second insulator structure and second interconnects therein, wherein respective inorganic dielectrics of the first insulator structure and the second insulator structure adjoin each other at a material interface;
• a first IC chip coupled to the interposer via first contacts which are in an arrangement which spans the material interface at a first side of the interposer;
• a second IC chip coupled to the interposer via second contacts, at a first surface of the first insulator structure, which are coupled to respective ones of the first contacts via the first interconnects;
• and
• a circuit board coupled to the interposer via third contacts, at a second side of the interposer opposite the first side, which are coupled to respective ones of the first contacts via the second interconnects.