Thermal interface structures, electrical systems with thermal interface structures, and methods of manufacture thereof

An electrical system comprising:

• an electronic component;
• a system heat sink;
• a composite thermal interface structure with a first surface contacting the electronic component and a second surface contacting the system heat sink, wherein the composite thermal interface structure includes a stack of a plurality of layers of a stiff thermal interface material, and a plurality of layers of a compliant thermal interface material stacked on and connected to the one or more layers of the stiff thermal interface material, wherein at least one of the plurality of layers of the compliant thermal interface material is formed between two of the plurality of layers of the stiff interface material, and wherein at least one of the plurality of layers of the stiff interface material is formed between two of the plurality of layers of the compliant thermal interface material.

A method of manufacturing a thermal interface structure and an electrical system, the method comprising:

• Assembling a stack of multiple layers of different thermal interface materials, wherein the stack includes a plurality of layers of a stiff thermal interface material, a plurality of layers of a compliant thermal interface material connected to the layers of the stiff thermal interface material, and one or more shape memory alloy layers formed below an uppermost surface of the stack and above a lowest surface of the stack, within or in contact with the layers of the compliant thermal interface material, wherein at least one of the plurality of layers of the compliant thermal interface material is formed between two of the plurality of layers of the stiff interface material, and wherein at least one of the plurality of layers of the stiff interface material is formed between two of the plurality of layers of the compliant thermal interface material.