Package structure and method for forming the same
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsPo-Chen Lai, Ming-Chih Yew, Li-Ling Liao, Chin-Hua Wang, Po-Yao Lin, Shin-Puu Jeng
Life of this patent
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Abstract
A package structure is provided. The package structure includes a redistribution structure over a substrate, a semiconductor die over the redistribution structure and electrically coupled to the substrate, and an underfill material over the substrate and encapsulating the redistribution structure and the semiconductor die. The underfill material includes an extension portion overlapping a corner of the semiconductor die and extending into the substrate.
Claims20
A package structure, comprising:
- a redistribution structure over a substrate;
- a semiconductor die over the redistribution structure and electrically coupled to the substrate;
- and
- an underfill material over the substrate and encapsulating the redistribution structure and the semiconductor die, wherein the underfill material includes an extension portion overlapping a corner of the semiconductor die and extending into the substrate, the substrate includes a first insulating layer and a first conductive trace embedded in the first insulating layer, a bottom surface of the extension portion is lower than a bottom surface of the first conductive trace, and in a plan view, a direction from a geometric center of the redistribution structure to the corner of the semiconductor die is defined as a first direction, and an angle of the first direction and a longitudinal direction of the extension portion is less than about 15 degrees.
A package structure, comprising:
- a plurality of bonding elements over a substrate;
- a redistribution structure over the bonding elements;
- a semiconductor die over the redistribution structure;
- and
- an underfill material comprising:
- a first portion surrounding the plurality of bonding elements;
- and
- a second portion embedded in the substrate, wherein in a plan view, a corner of the semiconductor die is confined within an area of the second portion, wherein in a plan view, a first direction from a geometric center of the redistribution structure extending to the corner of the semiconductor die is substantially parallel to a symmetry axis of the second portion.
A method for forming a package structure, comprising:
- bonding a semiconductor die to a first surface of a redistribution structure;
- bonding a package to the first surface of the redistribution structure;
- bonding a second surface of the redistribution structure to a substrate, wherein the substrate includes a first trench overlapping a corner of the semiconductor die and a second trench overlapping a corner of the package;
- and
- encapsulating the semiconductor die and the redistribution structure with an underfill material, wherein the first trench and the second trench of the substrate are filled with underfill material.
Dependencies are inferred from the claim text.