Semiconductor device, manufacturing method of semiconductor device, and electronic apparatus

A method of manufacturing a semiconductor device, the method comprising:

• a workpiece forming process of bonding a semiconductor substrate on which a plurality of semiconductor elements are formed by chip size packaging to a transmissive material to cover an optical element forming surface of the plurality of semiconductor elements with an adhesive layer to form a workpiece;
• a first cutting process of singulating the workpiece fixed to a dicing sheet into a plurality of main structures of the semiconductor device;
• a reconnecting process of filling a resin into first grooves which are gaps between the plurality of main structures fixed to the dicing sheet and curing the resin to reconnect the plurality of main structures;
• and
• a second cutting process of forming second grooves narrower than the first grooves in the resin along a substantially center of the first grooves to form a plurality of semiconductor devices while portions of the resin remain on side surfaces of the plurality of main structures, wherein the portions of the resin remaining on the side surfaces have a portion extending upward from an upper surface of the transmissive material, and wherein the portions of the resin remaining on the side surfaces have a rectangular shape in a cross-sectional view.

An electronic apparatus comprising:

• a semiconductor device including:
• a semiconductor element;
• a transmissive material bonded with an adhesive layer to cover an optical element forming surface of the semiconductor element;
• and
• a side surface protective resin which covers an entire side surface where a layer structure of the semiconductor element and the transmissive material are exposed, wherein the side surface protective resin has a portion extending upward from an upper surface of the transmissive material, and wherein the side surface protective resin has a rectangular shape in a cross-sectional view.