Manufacturing method of electronic package comprising a wire within an electronic component

A method of manufacturing an electronic package, comprising:

• providing a first electronic component including at least one conductive layer on a surface of the first electronic component, wherein the first electronic component includes an active surface and a non-active surface opposite to the active surface and side surfaces adjacent to the active surface and the non-active surface, wherein at least one electrode pad is disposed on the active surface, and at least one wire electrically connected with the at least one electrode pad, and is provided inside the first electronic component, such that the at least one conductive layer is electrically connected with the at least one wire, and the at least one conductive layer is free from being formed on the at least one electrode pad;
• and
• embedding the first electronic component along with the at least one conductive layer in an encapsulant.