Three-dimensional packaging structure and method for fan-out of bonding wall of device

A three-dimensional packaging method for fan-out of a bonding wall of a device, comprising:

• 1) dicing a device wafer to obtain the device, and the device comprising a plurality of bond pads,
• 2) placing the device on a temporary carrier by picking and placing,
• 3) encapsulating the device to form a fan-out surface that is defined by a first surface of an encapsulation material aligned with a first surface of the device,
• 4) separating the device, that has been encapsulated, from the temporary carrier to obtain a reconstituted wafer or square plate with the encapsulation material,
• 5) fabricating a wall structure on an edge of the first surface of the device and the fan-out surface, the wall structure partially covering a part of a surface of at least one of the plurality of bond pads away from the device, and the wall structure comprising a first opening corresponding to the at least one of the plurality of bond pads,
• 6) adding a cover plate on a surface of the wall structure to form a cavity corresponding to a functional area, the cover plate comprising a second opening corresponding to the at least one of the plurality of bond pads, wherein the at least one of the plurality of bond pads, the first opening, and the at least one second opening are overlapped, and
• 7) fabricating a metal interconnection structure electrically connected with a remaining part of the surface of the at least one of the plurality of bond pads away from the device.