Power semiconductor module having protrusions as fixing structures

A power semiconductor module, comprising:

• an electrically insulative frame having a first mounting side, a second mounting side opposite the first mounting side, and a border that defines a periphery of the electrically insulative frame;
• a first substrate seated in the electrically insulative frame;
• a plurality of power semiconductor dies attached to the first substrate;
• a plurality of signal pins attached to the first substrate and electrically connected to the power semiconductor dies;
• a plurality of busbars attached to the first substrate and extending through the border of the electrically insulative frame;
• a plurality of fixing positions at the first mounting side of the electrically insulative frame and configured to facilitate attachment of a base plate to the power semiconductor module at the first mounting side of the electrically insulative frame;
• and
• a plurality of electrically insulative protrusions jutting out from the second mounting side of the electrically insulative frame,
• wherein the plurality of electrically insulative protrusions is vertically aligned with the plurality of fixing positions and configured to facilitate attachment of a circuit board to the power semiconductor module at the second mounting side of the electrically insulative frame.