Semiconductor heat treatment member and manufacturing method thereof
AssigneeCoorstek Gk
InventorsSayaka Togashi, Nobuyuki Munakata, Kenji Suzuki
Life of this patent
Estimating the term…
Abstract
The present invention relates to a semiconductor heat treatment member for holding a semiconductor wafer, including a base member a surface of which is covered with an oxide film, the base member including a silicon carbide, in which a surface of a wafer holding portion to be in contact with a semiconductor wafer has an arithmetic average roughness Ra of smaller than or equal to 0.3 μm and an element average length RSm of shorter than or equal to 40 μm.
Claims5
A semiconductor heat treatment member for holding a semiconductor wafer, comprising a base member a surface of which is covered with an oxide film, the base member comprising silicon carbide, wherein a surface of a wafer holding portion to be in contact with a semiconductor wafer has an arithmetic average roughness Ra of smaller than or equal to 0.3 μm and an element average length RSm of shorter than or equal to 40 μm.
Dependencies are inferred from the claim text.