Electrostatic chuck, vacuum processing apparatus, and substrate processing method

A vacuum processing apparatus, comprising:

• a vacuum chamber;
• an electrostatic chuck including
• a chuck plate that has a first surface supporting a substrate and a second surface opposite to the first surface, and includes an exhaust passage that exhausts a gas emitted from the substrate from between the substrate and the first surface when the substrate is supported by the first surface;
• a support stage that is housed in the vacuum chamber and has a fifth surface and a sixth surface, the fifth surface supporting the electrostatic chuck, the sixth surface being opposite to the fifth surface;
• and
• a deposition shieled plate that surrounds the support stage and partitions an inside of the vacuum chamber into a first region and a second region, the electrostatic chuck being disposed in the first region, the support stage being disposed in the second region,
• wherein the support stage is provided with a different exhaust passage that exhausts the gas guided through the exhaust passage to the second region,
• wherein the chuck plate is an elastic member,
• wherein the first surface is provided with a plurality of convex portions and an annular convex portion that surrounds the plurality of convex portions,
• wherein a height h0 of the plurality of convex portions from the first surface is less than or equal to a height of the annular convex portion, and
• wherein the height h0 of the plurality of convex portions from the first surface is capable of being adjusted to a height h1 lower than the height h0 by electrostatically adsorbing the substrate to the first surface when the substrate is placed on the first surface provided with the plurality of convex portions.