Silicon carbide epitaxial substrate and method for manufacturing silicon carbide semiconductor device
AssigneeSumitomo Electric Industries, Ltd.
InventorsKenji Kanbara, Hironori Itoh, Tsutomu Hori
Life of this patent
Estimating the term…
Loading patent…
AssigneeSumitomo Electric Industries, Ltd.
InventorsKenji Kanbara, Hironori Itoh, Tsutomu Hori
Estimating the term…
When a value obtained by dividing the number of the one or more second regions by a total of the number of the one or more first regions and the number of the one or more second regions is defined as a first defect free area ratio, a value obtained by dividing the number of the one or more fourth regions by a total of the number of the one or more third regions and the number of the one or more fourth regions is defined as a second defect free area ratio, and a value obtained by dividing the number of the one or more macroscopic defects by an area of the central region is defined as X cm−2, A is smaller than B, B is less than or equal to 4, X is more than 0 and less than 4, and a Formula 1 is satisfied.
A silicon carbide epitaxial substrate comprising:
A silicon carbide epitaxial substrate comprising:
Dependencies are inferred from the claim text.