Sputtering apparatus

A sputtering apparatus comprising:

• a first target and a second target that emit sputter particles;
• a substrate support configured to support a substrate;
• a shielding plate disposed between the first and the second target and the substrate and having a through-hole through which the sputter particles pass, the through-hole having a first opening region through which the sputter particles emitted from the first target pass and a second opening region through which the sputter particles emitted from the second target pass;
• and
• an obstructing mechanism configured to obstruct the sputter particles emitted from the first target in passing through the second opening region and the sputter particles emitted in the second target from passing through the first opening region,
• wherein the through-hole has a first edge provided with a first adjusting member configured to adjust an opening area of the through-hole and a second edge provided with a second adjusting member configured to adjust the opening area of the through-hole,
• wherein the first opening region has the first edge and does not have the second edge, and
• wherein the second opening region has the second edge and does not have the first edge.