High temperature detachable very high frequency (VHF) electrostatic chuck (ESC) for PVD chamber

A substrate support for use in a substrate processing chamber, comprising:

• an upper assembly having a base plate assembly coupled to a cooling plate, wherein the base plate assembly includes a plurality of electrical feedthroughs disposed about a backside gas opening, and wherein the cooling plate includes a plurality of openings aligned with the plurality of electrical feedthroughs;
• an electrostatic chuck disposed on the upper assembly and removably coupled to the cooling plate, wherein the electrostatic chuck has an electrode disposed therein that is electrically coupled to a first pair of electrical feedthroughs of the plurality of electrical feedthroughs;
• an inner tube coupled to the cooling plate and configured to provide an RF delivery path to the electrostatic chuck via at least one of:
• a gap between the electrostatic chuck and the cooling plate, or backside metallization of the electrostatic chuck;
• and
• a first resistive heater embedded in the electrostatic chuck and electrically coupled to a second pair of the electrical feedthroughs;
• wherein at least one of:
• an upper surface of the cooling plate has a higher emissivity at a central portion than at a peripheral portion, or
• a lower surface of the electrostatic chuck includes a metallization pattern to provide RF contact with the cooling plate, or
• a lower surface of the electrostatic chuck includes an interface ring and five terminals disposed about the interface ring and aligned with the plurality of electrical feedthroughs, or
• the electrostatic chuck is coupled to the cooling plate via a fastener that extends through a central region of the electrostatic chuck, wherein the fastener extends through a nut plate and outer threads of the fastener engage with a threaded opening in the cooling plate to couple the electrostatic chuck to the cooling plate.

A process chamber, comprising:

• a chamber body having a substrate support disposed within an inner volume of the chamber body, wherein the substrate support comprises:
• an upper assembly having a base plate assembly coupled to a cooling plate, wherein the base plate assembly includes a plurality of electrical feedthroughs disposed about a backside gas opening, and wherein the cooling plate includes a plurality of openings aligned with the plurality of electrical feedthroughs;
• an electrostatic chuck disposed on the upper assembly and removably coupled to the cooling plate, wherein the electrostatic chuck has an electrode disposed therein that is electrically coupled to a first pair of electrical feedthroughs of the plurality of electrical feedthroughs;
• and
• a support assembly having an inner tube coupled to the cooling plate and configured to provide an RF delivery path to the electrostatic chuck via at least one of:
• a gap between the electrostatic chuck and the cooling plate, or
• backside metallization of the electrostatic chuck;
• wherein at least one of:
• further comprising a lower assembly that includes a ceramic block disposed on a housing, wherein the housing includes an outer lip that surrounds the ceramic block;
• or
• the plurality of electrical feedthroughs are disposed in a central protrusion of the cooling plate, or
• a flexible connector is disposed between the electrostatic chuck and each electrical feedthrough to allow for thermal expansion of the electrostatic chuck while maintaining electrical coupling.