High frequency capacitor and manufacturing method thereof

A high frequency capacitor comprising:

• a dielectric layer comprising a plurality of trench structures;
• an upper electrode formed on an upper surface of the dielectric layer and covering and filling the plurality of trench structures;
• a opening portion formed on the dielectric layer around an edge of the trench structures, and configured to expose a lower surface of the upper electrode;
• a lower electrode formed on a lower surface of the dielectric layer and covering and filling the plurality of trench structures and exposing the opening portion;
• an insulating layer formed on an upper surface of the upper electrode over the plurality of trench structures;
• a protective layer formed on a lower surface of the lower electrode and covering the dielectric layer and the insulating layer;
• a first space formed on the protective layer to expose a portion of the lower surface of the lower electrode;
• a second space formed on the protective layer to expose a portion of the lower surface of the upper electrode through the opening portion;
• a first pad formed on the first space and connected to the lower surface of the lower electrode, and configured to contact an external circuit;
• and
• a second pad formed on the second space and connected to the lower surface of the upper electrode, and configured to contact an external circuit.