Miniaturization process of passive component
AssigneeTrusval Technology Co., Ltd.
InventorShih-Pao Chien
Life of this patent
Estimating the term…
Abstract
A miniaturization process of passive electronic components is revealed. The miniaturization process mainly includes the steps of reforming, reacting at high temperature, preparing paste, dipping in the paste, light curing, packaging, heat curing, cutting pins, coating silver paste, heating and drying, and engraving by laser. The miniaturization process makes production of the passive components with thinner, smaller, and lightweight deign easier and the more convenient. The service life of the passive components is also extended and applications of the passive components are broader.
Claims32
A miniaturization process of passive electronic components comprising the steps of:
- A. reforming:
- placing a capacitor element connected with electrode pins into a reforming tank, using a hydrogen peroxide solution as an oxidizing agent, and applying a current for repairing reoxidation and oxidation of the capacitor element while the electrode pins are oxidized;
- B. reacting at high temperature:
- applying high temperature to the capacitor element already reformed after the step A to continue the oxidation reaction and release gas;
- C1. preparing paste:
- preparing a composite material including flexible epoxy used as main agent and micro-scale and nanoscale thermal conductive layered materials with high insulation and gas barrier properties by in situ composition, then mixing the composite material with a curing agent at adequate curing temperature homogeneously in a vacuum chamber to form a composite paste;
- C. dipping in paste:
- pumping the composite paste prepared in the step C1 to an impregnation tank, dipping the capacitor element in the composite paste, and removing redundant composite paste with gas so that a surface of the capacitor element is covered with the composite paste homogeneously;
- D. light curing:
- moving the capacitor element into a processing tank with a vacuum pump device and a light curing device for vacuum pumping and light curing of the composite paste on the capacitor element after the step C so that the composite paste is cured;
- E. packaging:
- placing the capacitor element on at least one truss after the step D, moving the truss into a corresponding mold, and performing injection molding of plastic under high temperature and high pressure for forming a plastic packaged surface covering the capacitor element;
- F. heat curing:
- moving the capacitor element to a processing tank with a vacuum pump device and a high temperature heater for being treated by vacuum pumping and high temperature heating after the step E;
- G. cutting pins:
- taking out the capacitor element after the step F, then removing the electrode pins projecting from the plastic packaged surface by cutting;
- H. coating silver paste:
- coating silver paste on positions where the electrode pins are removed by cutting and allowing the silver paste to extend from the electrode pins on an anode and a cathode to edges of two sides of the plastic packaged surface;
- I. heating and drying:
- heating and drying the silver paste and performing laser welding on positions where the electrode pins are in contact with the silver paste;
- and
- J. engraving by laser:
- engraving words or symbols for recognition on the plastic packaged surface by laser to complete the miniaturization process.
Dependencies are inferred from the claim text.