Electrode structure
AssigneeCyntec Co., Ltd.
InventorYi-Cheng Lin
Life of this patent
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Abstract
An electrode structure on a circuit board, the electrode structure comprising a metal structure disposed on and electrically connected to the circuit board, wherein the metal structure and a surface of the circuit board forms a space therebetween, wherein at least one first electrical component is disposed in the space and an outer surface of the metal structure forms an electrode for electrically connecting with an external component.
Claims19
An electrode structure on a circuit board, said electrode structure comprising a first metal structure disposed on and electrically connected to the circuit board, wherein the first metal structure and a first surface of the circuit board forms a first space therebetween, wherein at least one first electrical component is disposed in said first space and an outer surface of the first metal structure forms a first electrode for electrically connecting with an external component, wherein said electrode structure further comprises a second metal structure disposed on and electrically connected to the circuit board, wherein the second metal structure and a second surface of the circuit board forms a second space therebetween, wherein at least one second electrical component is disposed in said second space and an outer surface of the second metal structure forms a second electrode for electrically connecting with said external component.
An electrode structure on a circuit board, said electrode structure comprising a first metal structure disposed on and electrically connected to the circuit board, wherein the first metal structure and a first surface of the circuit board forms a first space therebetween, wherein at least one first electrical component is disposed in said first space and an outer surface of the first metal structure forms a first electrode for electrically connecting with an external component, wherein the first metal structure comprises a copper layer, a nickel layer overlaid on the copper layer, and an aluminum layer overlaid on the nickel layer.
Dependencies are inferred from the claim text.