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US 12,014,852 B2Granted
Sensor element and method for producing a sensor element
AssigneeTDK Electronics Co., Ltd.
InventorsJan Ihle, Thomas Bernert, Gerald Kloiber
Life of this patent
Estimating the term…
Abstract
In an embodiment a sensor element includes at least one carrier layer having a top side and an underside and at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and includes a material having a temperature-dependent electrical resistance, wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and wherein the sensor element is configured to measure a temperature.
Claims18
A sensor element comprising:
- at least one carrier layer having a top side and an underside;
- at least one functional layer arranged at the top side of the carrier layer and comprising a material having a temperature-dependent electrical resistance;
- and
- at least one protective layer,
- wherein the protective layer is arranged at a top side of the sensor element and at at least one side surface of the sensor element,
- wherein the protective layer completely covers the top side of the sensor element,
- wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system, and
- wherein the sensor element is configured to measure a temperature.
5 more elements
A sensor element comprising:
- at least one carrier layer having a top side and an underside;
- at least one functional layer, wherein the functional layer is arranged at the top side of the carrier layer and comprises a material having a temperature-dependent electrical resistance;
- and
- at least one protective layer arranged at a top side of the sensor element and at least one side surface of the sensor element, wherein the protective layer completely covers the top side of the sensor element,
- wherein the sensor element is configured to be integrated as a discrete component directly into an electrical system,
- wherein the sensor element is configured for direct integration into a MEMS structure and/or into a semiconductor embedded in substrate (SESUB) structure, and
- wherein the sensor element is configured to measure a temperature.
4 more elements
Dependencies are inferred from the claim text.