Memory system

A memory system comprising:

• a first plate including a second opening provided at a position corresponding to a first non-volatile memory package;
• an intermediate member that includes a second plate and a pair of side walls, the second plate including a first opening, the second plate being arranged to have a gap with respect to the first plate, the second plate including a first face facing the first plate and a second face located on a side opposite to the first face, the pair of side walls being arranged on the second face, the second plate including a second protrusion provided at a position on the first face corresponding to the first non-volatile memory package;
• and
• a substrate that is placed between the pair of side walls, the substrate including a third face on which both the first non-volatile memory package containing a first non-volatile memory chip and a controller package containing a controller chip for controlling the first non-volatile memory chip are mounted, the third face facing the second plate, wherein
• the first non-volatile memory package is thermally connected to the second plate,
• the controller package is thermally connected to the first plate through the first opening,
• the second protrusion protrudes through an inner side of the second opening, and
• an end surface of the second protrusion is flush with a second surface of the first plate, the second surface of the first plate is located on a side opposite to a first surface of the first plate, the first surface of the first plate facing the second plate.

A memory system comprising:

• a first plate;
• an intermediate member that includes a second plate and a pair of side walls, the second plate including a first opening, the second plate being arranged to have a gap with respect to the first plate, the second plate including a first face facing the first plate and a second face located on a side opposite to the first face, the pair of side walls being arranged on the second face, the pair of side walls extending from the second plate;
• a substrate that is placed between the pair of side walls, the substrate including a third face on which both a first non-volatile memory package containing a first non-volatile memory chip and a controller package containing a controller chip for controlling the first non-volatile memory chip are mounted, the third face facing the second plate;
• a third plate that covers a fourth face of the substrate, the fourth face is on a side opposite to the third face;
• and
• a fourth plate that is provided between the pair of side walls of the intermediate member, the fourth plate that covers the fourth face of the substrate, wherein
• the first non-volatile memory package is thermally connected to the second plate,
• the controller package is thermally connected to the first plate through the first opening,
• on the fourth face of the substrate, a second non-volatile memory package containing a second non-volatile memory chip controlled by the controller chip is mounted, the second non-volatile memory package being thermally connected to the third plate,
• the second plate, the pair of side walls, and the fourth plate form a tubular structure,
• the substrate is placed in an inner side of the tubular structure, and
• the third plate covers the fourth plate.