Display panel and manufacturing method thereof
AssigneeWuhan China Star Optoelectronics Semiconductor Display Technology Co., Ltd.
InventorLei Wang
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Abstract
The present disclosure provides a display panel and a manufacturing method thereof. The display panel includes a thin-film transistor structure layer, an OLED light-emitting layer disposed on the thin-film transistor structure layer and including light-emitting color sub-pixels arranged at intervals, a touch layer disposed on the OLED light-emitting layer, and a color filter including color film layers disposed on the light-emitting color sub-pixels and a color resist layer located among the color film layers.
Claims9
A display panel, comprising:
- a thin-film transistor structure layer;
- an organic light emitting diode (OLED) light-emitting layer disposed on the thin-film transistor structure layer, wherein the OLED light-emitting layer includes a first light-emitting color sub-pixel, a second light-emitting color sub-pixel, and a third light-emitting color sub-pixel that are arranged at intervals;
- a touch layer disposed on the OLED light-emitting layer;
- and
- a color filter including a first color film layer disposed on the first light-emitting color sub-pixel, and a color resist layer located near the first color film layer;
- wherein the color resist layer includes the first color film layer disposed on the touch layer;
- wherein the touch layer includes:
- a planarization layer disposed on a side of an array substrate facing the color filter;
- a first metal layer disposed on the planarization layer and including a first metal electrode been patterned;
- an insulating layer disposed on the planarization layer and covering the first metal layer, wherein the first color film layer and the insulating layer are provided in a same layer;
- and
- a second metal layer disposed on the insulating layer and including a second metal electrode been patterned, wherein the second metal electrode is connected to the first metal electrode, and the color resist layer is disposed on the second metal electrode;
- wherein the display panel further includes an opening penetrating from a surface of the color resist layer to a surface of the first color film layer;
- wherein the color filter further includes a protective layer filled in the opening and covering the color resist layer.
A manufacturing method for manufacturing a display panel, wherein the manufacturing method comprises steps of:
- providing a thin-film transistor structure layer;
- disposing an organic light emitting diode (OLED) light-emitting layer on the thin-film transistor structure layer;
- forming a touch layer on the OLED light-emitting layer;
- and
- disposing a color filter on the touch layer, wherein a color resist layer is formed on the touch layer;
- wherein the step of forming the touch layer includes:
- depositing silicon nitride material to form a planarization layer on an array substrate;
- depositing a metal material to form a first metal layer including a first metal electrode on the planarization layer;
- depositing a silicon nitride material to form an insulating layer on the first metal layer, and forming a through hole of the insulating layer penetrating the insulating layer;
- and
- depositing a metal material on the insulating layer, and forming a second metal layer including a second metal electrode in the through hole, wherein the second metal electrode is connected to the first metal electrode through the through hole;
- wherein in the step of disposing the color filter, the color resist layer is formed by:
- depositing a red color resist material on the touch layer to form a red color resist layer;
- depositing a green color resist material on the red color resist layer to form a green color resist layer;
- and
- depositing a blue color resist material on the green color resist layer to form a blue color resist layer;
- wherein after forming the color resist layer, further including:
- providing a mask to place above the color resist layer, wherein the mask includes holes, a photoresist is coated on the mask and the color resist layer corresponding to the holes, and the color resist layer corresponding to the holes is removed to form a first hole penetrating the color resist layer;
- etching the second metal layer in the first hole and removing the insulating layer corresponding to the first hole to form a second hole, wherein the first hole and the second hole commonly form an opening;
- depositing a color resist material in the opening to form a first color film layer, wherein the first color film is provided in a same layer as the insulating layer;
- and
- filling an organic protective glue in the opening and covering the color resist layer to form a protective layer.
Dependencies are inferred from the claim text.