Semiconductor unit, method of manufacturing the same, and electronic apparatus
AssigneeSony Group Corporation
InventorHironobu Abe
Life of this patent
Estimating the term…
Abstract
There are provided a semiconductor unit that prevents connection failure caused by a wiring substrate to improve reliability, a method of manufacturing the semiconductor unit, and an electronic apparatus including the semiconductor unit. The semiconductor unit includes: a device substrate including a functional device and an electrode; a first wiring substrate electrically connected to the functional device through the electrode; and a second wiring substrate electrically connected to the functional device through the first wiring substrate.
Claims20
A semiconductor unit, comprising:
- a device substrate including a functional device and an electrode;
- a first wiring substrate electrically connected to the functional device through the electrode;
- and
- a second wiring substrate electrically connected to the functional device through the first wiring substrate, wherein the second wiring substrate is connected to a first drive circuit transmitting external signals.
A semiconductor unit, comprising:
- a device substrate including a functional device and an electrode;
- a first wiring substrate electrically connected to the functional device through the electrode;
- and
- a second wiring substrate electrically connected to the functional device through the first wiring substrate, wherein the device substrate is configured of a flexible material.
A semiconductor unit, comprising:
- a device substrate including a functional device and an electrode;
- a first wiring substrate electrically connected to the functional device through the electrode;
- and
- a second wiring substrate electrically connected to the functional device through the first wiring substrate,
- wherein each of the first wiring substrate and the second wiring substrate is configured of a flexible material,
- wherein the device substrate includes a first surface, a second surface, and a third surface, the second surface opposing to the first surface, the third surface connecting the first surface and the second surface,
- wherein the first wiring substrate is provided from the first surface to the third surface of the device substrate and has a protective portion partially covering the first wiring substrate, and
- wherein the protective portion faces a corner configured of the first surface and the third surface of the device substrate.
A semiconductor unit, comprising:
- a device substrate including a functional device and an electrode;
- a first wiring substrate electrically connected to the functional device through the electrode;
- and
- a second wiring substrate electrically connected to the functional device through the first wiring substrate,
- wherein end surfaces of the first wiring substrate and the second wiring substrate are aligned.
A method of manufacturing a semiconductor unit, the method comprising:
- forming a device substrate including a functional device and an electrode, the electrode being electrically connected to the functional device;
- and
- electrically connecting a first wiring substrate to the electrode and to a second wiring substrate, wherein the first wiring substrate is electrically connected to the electrode and to the second wiring substrate after a thick film portion is provided an end of one or both of the second wiring substrate and the first wiring substrate.
A method of manufacturing a semiconductor unit, the method comprising:
- forming a device substrate including a functional device and an electrode, the electrode being electrically connected to the functional device;
- and
- electrically connecting a first wiring substrate to the electrode and to a second wiring substrate, wherein the electrical connection between the first wiring substrate and the electrode and the electrical connection between the first wiring substrate and the second wiring substrate are performed at a same time.
A method of manufacturing a semiconductor unit, the method comprising:
- forming a device substrate including a functional device and an electrode, wherein the electrode is electrically connected to the functional device;
- and
- electrically connecting a first wiring substrate to the electrode and to a second wiring substrate, wherein the electrical connection between the first wiring substrate and the second wiring substrate is performed after the electrical connection between the first wiring substrate and the electrode is performed.
Dependencies are inferred from the claim text.