Display device having filler and seal, and method for manufacturing the same

A method of manufacturing a display device, the method comprising the steps of:

• preparing an array substrate including a pixel array disposed on a base substrate, a transfer wiring electrically connected to the pixel array, a conductive pattern electrically connected to the transfer wiring, and an inorganic insulation layer covering the conductive pattern;
• forming a seal and a filler, the seal disposed between the array substrate and a cover substrate, the filler, being spaced apart from the seal, the filer substantially consisting of an inorganic material overlapping at least a portion of the conductive pattern, and filling a space between the array substrate and the cover substrate;
• removing a portion of the array substrate to dispose a side terminal from the conductive pattern and/or, the side terminal being exposed through a side surface of the array substrate;
• and
• forming a conductive connection pad on the side surface of the array substrate, the conductive connection pad contacting the side terminal,
• wherein the filler comprises a first filler and a second filler spaced apart from the seal and the first filler with an air gap provided between the first filler and the second filler, wherein the first filling member and the second filling member are disposed along only a side of the array substrate where the side terminal is disposed,
• wherein the second filler fills a second space between the array substrate and the cover substrate,
• wherein the first filler has an outer side surface continuously connected to an outer side surface of the inorganic insulation layer and contacting the conductive connection pad,
• wherein the conductive pattern includes an upper conductive layer and a lower conductive layer disposed under the upper conductive layer with an intervening layer between the upper conductive layer and the lower conductive layer, and
• wherein both of the upper conductive layer and the lower conductive layer contact the conductive connection pad.