Foundational supports within integrated assemblies

An integrated assembly, comprising:

• a base;
• memory cells over the base and along channel-material-pillars;
• a conductive structure extending under each of the memory cells between the memory cells and the base;
• the channel-material-pillars being coupled with the conductive structure;
• and
• a foundational support pins extending into the base and projecting upwardly to a level above the conductive structure, an upper surface of the support pins being below a lowest of the memory cells, the foundational support pins comprising a conductive material.

An integrated assembly, comprising:

• a base;
• a conductive-source-structure over the base;
• a memory level over the conductive-source-structure and comprising memory cells along channel-material-pillars;
• and
• first foundational-support-pins extending into the base and projecting upwardly through the conductive-source-structure;
• and
• at least one second foundational-support-pin which anchors the memory level to the conductive-source-structure, and which does not extend into the base.