High power multilayer module having low inductance and fast switching for paralleling power devices
AssigneeWolfspeed, Inc.
InventorsDaniel Martin, Brice McPherson, Alexander Lostetter
Life of this patent
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AssigneeWolfspeed, Inc.
InventorsDaniel Martin, Brice McPherson, Alexander Lostetter
Estimating the term…
The disclosure is directed to a power module that includes at least one power substrate, a housing arranged on the at least one power substrate, and a first terminal electrically connected to the at least one power substrate. The first terminal includes a contact surface located above the housing at a first elevation. The power module includes a second terminal including a contact surface located above the housing at a second elevation different from the first elevation, a third terminal electrically connected to the at least one power substrate, and a plurality of power devices electrically connected to the at least one power substrate.
A process of configuring and testing at least one power module, comprising:
A test configuration configured to test a power module configuration having at least one power module, the test configuration comprising:
An inverter, the inverter comprising:
A power module, comprising:
Dependencies are inferred from the claim text.