Nucleation control system and method leading to enhanced boiling based electronic cooling

A cooling module for an electronic device, the cooling module comprising:

• a body having formed therein a plurality of channels, each channel of the plurality of channels defined by a first channel surface positioned between opposing lateral channel surfaces to define a rectangular cross section normal to a channel axis;
• a micro-structured boiling surface positioned adjacent the first channel surface of each channel;
• a first piezoelectric transducer in acoustic communication with one of the opposing lateral channel surfaces of each channel and a second piezoelectric transducer in acoustic communication with the other opposing lateral channel surface, each transducer configured to direct acoustic waves on the micro-structured boiling surface;
• an inlet header in fluid communication with each channel of the plurality of channels;
• and
• an outlet header in fluid communication with each channel of the plurality of channels,
• wherein the first and second piezoelectric transducers are transverse mode piezoelectric transducers having a resonant frequency (fp), and further including a controller configured to provide a range of acoustic modulating frequencies (fM) to the transducers resulting from signals of modulating strengths available at fp and fp±n·fM where “n≥1” is an integer.