Chip to server packaging design for immersion systems

A server, comprising:

• a chassis frame housing a server board having a plurality of electronic chips that are submersible in an immersion environment;
• a perforation region at an end of a server chassis for an immersion fluid to enter or exit the immersion environment;
• and
• a cooling module contained within the chassis frame, the cooling module comprises:
• a first cooling plate having a first internal channel;
• a second cooling plate having a second internal channel;
• an interconnect frame coupled in between the first and second cooling plates, the interconnect frame includes a third internal channel that connects to the first and second internal channels;
• and
• a first injection plate attached to a bottom portion of the first cooling plate and a second injection plate attached to a bottom portion of the second cooling plate, the first and second injection plates manage a distribution of coolant fluid to dedicated areas of electronic chips adjacent to the corresponding first and second injection plates.

A cooling system, comprising:

• an immersion unit;
• and
• a server submersible in the immersion unit, the server, comprising:
• a chassis frame housing a server board having a plurality of electronic chips that are submersible in an immersion environment;
• a perforation region at an end of the server for an immersion fluid to enter or exit the immersion environment;
• and
• a cooling module contained within the chassis frame, the cooling module comprises:
• a first cooling plate having a first internal channel;
• a second cooling plate having a second internal channel;
• an interconnect frame coupled in between the first and second cooling plates, the interconnect frame includes a third internal channel that connects to the first and second internal channels;
• and
• a first injection plate attached to a bottom portion of the first cooling plate and a second injection plate attached to a bottom portion of the second cooling plate, the first and second injection plates manage a distribution of coolant fluid to dedicated areas of electronic chips adjacent to the corresponding first and second injection plates.