Flexible interconnect circuits and methods of fabrication thereof
AssigneeCelLink Corporation
InventorsJean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
Life of this patent
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AssigneeCelLink Corporation
InventorsJean-Paul Ortiz, Malcom Parker Brown, Mark Terlaak, Will Findlay, Kevin Michael Coakley, Casey Anderson
Estimating the term…
Provided are flexible interconnect circuit assemblies and methods of fabricating thereof. In some examples, a flexible interconnect circuit comprises multiple circuit portions, which are monolithically integrated. During the fabrication, some of these circuit portions are folded relative to other portions, forming a stack in each fold. For example, the initial orientation of these portions can be selected such that smaller sheets can be used for circuit fabrication. The portions are then unfolded into the final design configuration. In some examples, the assembly also comprises a bonding film and a temporary support film attached to the bonding film such that the two circuit portions at least partially overlap with the bonding film and are positioned between the bonding film and temporary support film. In some examples, at least some circuit portions extend past the boundary of the bonding film and are coupled to connectors.
A flexible interconnect circuit comprising:
A method of attaching a connector to a flexible interconnect circuit, the method comprising:
Dependencies are inferred from the claim text.