Device, electronic apparatus, and wiring connection method

An electronic apparatus, comprising

• a device that includes:
• a base having elasticity;
• a device body on the base;
• a wiring line on the base;
• a coupling member coupled to the wiring line;
• and
• an electrically conductive adhesive layer between the wiring line and the coupling member, wherein
• the wiring line extends from the electrically conductive adhesive layer to the device body,
• the wiring line has a wiring portion overlapping with the electrically conductive adhesive layer,
• the electrically conductive adhesive layer includes:
• a plurality of electrically conductive particles;
• a peripheral portion;
• a first region that includes the plurality of electrically conductive particles in a crushed state;
• and
• a second region closer to the peripheral portion of the electrically conductive adhesive layer than the first region,
• the second region includes the plurality of electrically conductive particles in an uncrushed state,
• each of the first region and the second region of the electrically conductive adhesive layer is in contact with the wiring portion, and
• the electrically conductive adhesive layer has a degree of polymerization that decreases from the first region to the second region in an extending direction of the wiring portion.

A wiring coupling method, comprising:

• overlaying a coupling member on a wiring line via an electrically conductive adhesive layer, wherein
• the wiring line is on an elastic base,
• the wiring line has a wiring portion that overlaps with the electrically conductive adhesive layer,
• the electrically conductive adhesive layer includes:
• a plurality of electrically conductive particles;
• a peripheral portion;
• a first region that includes the plurality of electrically conductive particles in a crushed state;
• and
• a second region closer to the peripheral portion than the first region,
• the second region includes the plurality of electrically conductive particles in an uncrushed state,
• each of the first region and the second region of the electrically conductive adhesive layer is in contact with the wiring portion, and
• the electrically conductive adhesive layer has a degree of polymerization that decreases from the first region to the second region in an extending direction of the wiring portion;
• and
• pressing and heating a portion of the first region and the second region inward from the peripheral portion of the electrically conductive adhesive layer.