Back to results
US 12,010,416 B1Granted
Camera module including embedded ceramic substrate package
AssigneeApple Inc.
InventorsWei Shi, Adar Magen
Life of this patent
Estimating the term…
Abstract
An embedded ceramic substrate package includes a ceramic substrate embedded in one or more layers. The one or more layers include at least a bulk molding compound (BMC) and a redistribution layer (RDL). At least a portion of the one or more layers includes electrical signal trace routing. The embedded ceramic substrate package is attached to an image sensor that is configured to capture light projected onto a surface of the image sensor.
Claims20
A camera module, comprising:
- an image sensor configured to capture light projected onto a surface of the image sensor;
- and
- an embedded ceramic substrate package directly attached to the image sensor, the embedded ceramic substrate package comprising:
- a bulk molding compound (BMC);
- a ceramic substrate embedded in the BMC;
- and
- one or more redistribution layers (RDLs) coupled to the BMC, at least one of the RDLs being on at least one surface of the BMC;
- wherein at least one of the BMC or one of the RDLs is directly attached to the image sensor, and wherein at least one of the BMC or one of the RDLs includes electrical signal trace routing coupled to the image sensor.
5 more elements
An embedded ceramic substrate package, comprising:
- a bulk molding compound (BMC);
- a ceramic substrate embedded in the BMC;
- and
- one or more redistribution layers (RDLs) coupled to the BMC, at least one of the RDLs being on at least one surface of the BMC;
- wherein at least one of the BMC or one of the RDLs is directly attached to an image sensor that is configured to capture light projected onto a surface of the image sensor;
- and
- wherein at least a portion of the BMC or one of the RDLs includes electrical signal trace routing coupled to the image sensor.
4 more elements
A mobile device, comprising:
- one or more processors;
- one or more cameras;
- and
- a memory comprising program instructions executable by at least one of the one or more processors to control operations of the one or more cameras;
- wherein at least one of the cameras includes a camera module comprising:
- an image sensor configured to capture light projected onto a surface of the image sensor;
- and
- an embedded ceramic substrate package directly attached to the image sensor, the embedded ceramic substrate package comprising:
- a bulk molding compound (BMC);
- a ceramic substrate embedded in the BMC;
- and
- one or more redistribution layers (RDLs) coupled to the BMC, at least one of the RDLs being on at least one surface of the BMC;
- wherein at least one of the BMC or one of the RDLs is directly attached to the image sensor, and wherein at least a portion of the BMC or one of the RDLs includes electrical signal trace routing coupled to the image sensor.
10 more elements
Dependencies are inferred from the claim text.