Antenna package

A package comprising:

• an upper level including:
• a stack comprising insulating layers and conductive elements;
• a plastic element having a first side resting on the stack, a second side opposite the first side, and including a first cavity extending into the plastic element from said first side with a first height that is less than a thickness of the plastic element between the first and second sides;
• and
• an antenna, comprising a first conductive track in the stack and a second conductive track on a wall of the plastic element;
• wherein the plastic element further includes a second cavity extending into the plastic element from said first side with a second height that is less than said thickness of the plastic element between the first and second sides, said second cavity surrounding the first cavity.

A package further comprising:

• an upper level including:
• a stack comprising insulating layers and conductive elements;
• a plastic element having a first side resting on the stack, a second side opposite the first side, and including a first cavity extending into the plastic element from said first side with a first height that is less than a thickness of the plastic element between the first and second sides;
• and
• an antenna, comprising a first conductive track in the stack and a second conductive track on a wall of the plastic element
• a lower level;
• wherein the upper level is attached to the lower level by electrical connecting elements;
• wherein a third cavity is defined between the upper level and the lower level and surrounded by said electrical connecting elements;
• and
• an integrated circuit chip located within the third cavity and electrically connected to the antenna.

A method for manufacturing a package, comprising:

• forming an upper level by:
• forming a stack comprising insulating layers and conductive elements and including a first conductive track forming part of an antenna;
• forming a plastic element having a first side and a second side opposite the first side, wherein forming the plastic element includes forming a first cavity extending into the plastic element from said first side with a first height that is less than a thickness of the plastic element between the first and second sides;
• mounting the plastic element to the stack with the first side resting on the stack and the first cavity closed by the stack;
• and
• forming a second conductive track resting on a wall of the plastic element.

A method comprising:

• forming an upper level by:
• forming a stack comprising insulating layers and conductive elements and including a first conductive track forming part of an antenna;
• forming a plastic element having a first side and a second side opposite the first side, wherein forming the plastic element includes forming a first cavity extending into the plastic element from said first side with a first height that is less than a thickness of the plastic element between the first and second sides;
• mounting the plastic element to the stack with the first side resting on the stack and the first cavity closed by the stack;
• and
• forming a second conductive track resting on a wall of the plastic element
• wherein forming the plastic element further includes forming a second cavity extending into the plastic element from said first side with a second height that is less than said thickness of the plastic element between the first and second sides, said second cavity surrounding the first cavity.

A method comprising:

• forming an upper level by:
• forming a stack comprising insulating layers and conductive elements and including a first conductive track forming part of an antenna;
• forming a plastic element having a first side and a second side opposite the first side, wherein forming the plastic element includes forming a first cavity extending into the plastic element from said first side with a first height that is less than a thickness of the plastic element between the first and second sides;
• mounting the plastic element to the stack with the first side resting on the stack and the first cavity closed by the stack;
• and
• forming a second conductive track resting on a wall of the plastic element forming a lower level;
• and
• attaching the upper level to lower level, said attaching defining, between the upper level and the lower level, a third cavity.