Method for producing a conversion element, and conversion element
AssigneeOSRAM OLED GmbH
InventorLuca Haiberger
Life of this patent
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Abstract
The invention relates to a method for producing a conversion element having the following steps: providing a frame having an opening; applying a sacrificial layer at least to a side surface of the at least one opening; applying a reflective layer to the sacrificial layer; introducing a conversion material into the at least one opening, the conversion material covering the reflective layer; and removing the sacrificial layer and the frame.
Claims6
A method for producing a conversion element, comprising:
- providing a frame having at least one opening,
- applying a sacrificial layer at least to a side surface of the at least one opening,
- applying a reflective layer to the sacrificial layer,
- introducing a conversion material into the at least one opening, wherein the conversion material covers the reflective layer,
- chemically etching the sacrificial layer to remove the sacrificial layer, and
- removing the fame, wherein the reflective layer terminates flush with a bottom surface and a top surface of the conversion material.
The method as claimed in the preceding claim, wherein the side surface of the at least one opening has a chamfer.
The method as claimed in the preceding claim, wherein the conversion material introduced partly surrounds the radiation-emitting semiconductor chip.
A method for producing a conversion element, which is able to be applied on a radiation-emitting semiconductor chip, comprising:
- providing a frame having at least one opening,
- applying a sacrificial layer at least to a side surface of the at least one opening,
- applying a reflective layer to the sacrificial layer,
- introducing a conversion material into the at least one opening, wherein the conversion material covers the reflective layer,
- chemically etching the sacrificial layer to remove the sacrificial layer, and
- removing the frame.
Dependencies are inferred from the claim text.