Light-emitting device, light-emitting assembly, and integrated circuit flip-chip

A light-emitting assembly, comprising:

• an integrated circuit (IC) flip-chip including a plurality of flip-chip pads;
• a plurality of light-emitting diode (LED) flip-chips spaced apart from the IC flip-chip;
• and
• a light-permeable package body being an integrally formed one-piece structure and covering the IC flip-chip and the LED flip-chips, wherein the light-emitting assembly does not include any substrate for carrying the IC flip-chip and the LED flip chips, the LED flip-chips have a plurality of electrodes, and the flip-chip pads of the IC flip-chip and the electrodes of the LED flip-chips are exposed outside of the light-permeable package body.

An integrated circuit (IC) flip-chip, comprising:

• a chip body;
• a plurality of metal pads disposed on a surface of the chip body;
• a redistribution layer formed on the surface of the chip body, wherein the metal pads are embedded in the redistribution layer;
• and
• a plurality of flip-chip pads disposed on the redistribution layer and electrically coupled to the metal pads through the redistribution layer, wherein the flip-chip pads and the metal pads each have a layout distribution, and the layout distribution of the flip-chip pads is more even than the layout distribution of the metal pads.