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US 12,009,377 B2Granted
Solid-state imaging device and electronic apparatus for curbing deterioration of picture quality
AssigneeSony Semiconductor Solutions Corporation
InventorsYutaka Ooka, Taizo Takachi, Yuichi Yamamoto
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Abstract
Picture quality deterioration is curbed. A solid-state imaging device according to an embodiment includes: a semiconductor substrate (131) including a light-receiving element; an on-chip lens (132) disposed on a first surface of the semiconductor substrate; a resin layer (133) covering the on-chip lens; and a glass substrate (134) disposed on the side of the first surface of the semiconductor substrate separately from the resin layer.
Claims19
A solid-state imaging device, comprising:
- a semiconductor substrate including a light-receiving element;
- an on-chip lens disposed on a first surface of the semiconductor substrate;
- a resin layer that covers the on-chip lens;
- and
- a glass substrate disposed on a side of the first surface of the semiconductor substrate separately from the resin layer, wherein the glass substrate includes a first trench in a surface that faces the semiconductor substrate.
2 more elements
A solid-state imaging device, comprising:
- a semiconductor substrate including a plurality of light-receiving elements;
- an on-chip lens disposed on a first surface of the semiconductor substrate;
- a glass substrate disposed on a side of the first surface of the semiconductor substrate separately from the on-chip lens;
- and
- a plurality of pillar-shaped structures for one of the plurality of light-receiving elements, wherein the plurality of pillar-shaped structures supports the glass substrate against the semiconductor substrate.
2 more elements
An electronic apparatus, comprising:
- a solid-state imaging device;
- an optical system configured to image incident light on a light-receiving surface of the solid-state imaging device;
- and
- a processor configured to control the solid-state imaging device, wherein the solid-state imaging device includes:
- a semiconductor substrate including a light-receiving element;
- an on-chip lens disposed on a first surface of the semiconductor substrate;
- a resin layer that covers the on-chip lens;
- a glass substrate disposed on a side of the first surface of the semiconductor substrate separately from the resin layer;
- a structure in a wall shape that supports the glass substrate against the semiconductor substrate;
- and
- a light-shielding film on a surface, of the structure, that is on the side of the semiconductor substrate.
8 more elements
Dependencies are inferred from the claim text.