Highly integrated transmitter module for LiDAR

An optical sensing method, comprising:

• emitting, by an integrated transmitter module of an optical sensing system, an optical signal into an environment surrounding the optical sensing system,
• wherein the integrated transmitter module comprises a laser emitter, one or more driving integrated circuits (ICs), and one or more optics integrated into a chamber that is hermetically sealed,
• wherein a first set of pins is disposed on an inner surface of the chamber and electrically connected to the one or more driving ICs through a set of bonding wires,
• wherein the one or more driving ICs and the laser emitter are integrated onto a printed circuit board (PCB), and
• wherein the PCB and the one or more optics are mounted onto a substrate, and the PCB and the substrate are different components but comprise an identical material;
• detecting, by a photodetector of the optical sensing system, the optical signal reflected from the environment surrounding the optical sensing system;
• converting, by the photodetector, the detected optical signal to an electrical signal;
• and
• converting, by a readout circuit of the optical sensing system, the electrical signal to a digital signal,
• wherein the photodetector and the readout circuit are located outside the chamber enclosing the integrated transmitter module.

An integrated transmitter module for an optical sensing system, comprising:

• a laser emitter configured to emit an optical signal to an environment surrounding the optical sensing system;
• one or more driving integrated circuits (ICs) configured to drive the laser emitter to emit the optical signal;
• and
• one or more optics configured to shape the optical signal into a predefined shape for emitting to the environment,
• wherein the laser emitter, the one or more driving ICs, and the one or more optics are integrated into a hermetically sealed chamber,
• wherein a set of pins is disposed on an inner surface of the chamber and electrically connected to the one or more driving ICs through a set of bonding wires,
• wherein the one or more driving ICs and the laser emitter are integrated onto a printed circuit board (PCB), and
• wherein the PCB and the one or more optics are mounted onto a substrate, and the PCB and the substrate are different components but comprise an identical material.