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US 12,009,351 B2Granted
Plurality of semiconductor devices between stacked substrates
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorWei-Hao Chang
Life of this patent
Estimating the term…
Abstract
A semiconductor device package and a method for manufacturing the semiconductor device package are provided. The semiconductor device package includes a first substrate, a second substrate disposed over the first substrate and having a first surface facing away from the first substrate and a second surface facing the first substrate, a first component disposed on the first surface of the second substrate, a second component disposed on the second surface of the second substrate; and a support member covering the first component.
Claims8
An electronic device, comprising:
- a first substrate,
- a second substrate disposed over the first substrate and having a first surface facing away from the first substrate and a second surface facing the first substrate,
- a first component disposed on the first surface of the second substrate;
- a second component disposed on the second surface of the second substrate;
- and
- a support member covering the first component;
- wherein the support member is configured to be attached to a tape so that a divided operation on the second substrate can be performed;
- wherein a third component is disposed on the first substrate and underneath the second substrate;
- wherein a portion of the first substrate is free from being covered by the second substrate;
- wherein a fourth component is disposed on the portion of the first substrate;
- wherein a first package body is disposed on the first substrate and cover the third component and the fourth component.
8 more elements
An electronic device, comprising:
- a first substrate,
- a second substrate disposed over the first substrate and having a first surface facing away from the first substrate, a second surface facing the first substrate and a side surface between the first surface and the second surface,
- a first component disposed on the first surface of the second substrate;
- a second component disposed on the second surface of the second substrate
- a third component disposed on the first substrate and under the second substrate;
- and
- a first package body covering the first component and having a lateral surface substantially coplanar with the side surface of the second substrate;
- wherein a portion of the first substrate is free from being covered by the second substrate
- wherein a fourth component is disposed on the portion of the first substrate;
- wherein a second package body is disposed on the portion of the first substrate and covers the third component and the fourth component.
7 more elements
An electronic device, comprising:
- a first substrate,
- a second substrate disposed over the first substrate and having a first surface facing away from the first substrate, a second surface facing the first substrate and a side surface between the first surface and the second surface,
- a first component disposed on the first surface of the second substrate;
- a second component disposed on the second surface of the second substrate
- a third component disposed on the first substrate and under the second substrate;
- a first package body covering the first component and having a lateral surface substantially coplanar with the side surface of the second substrate;
- wherein a portion of the first substrate is free from being covered by the second substrate;
- a third substrate disposed under the first substrate and having a first surface facing away from the first substrate;
- a fifth component disposed on the first surface of the third substrate;
- and
- a third package body disposed on the first surface of the third substrate and covering the fifth component;
- wherein the third package body has a surface facing away from the third substrate and the fifth component is exposed from the surface of the third package body.
9 more elements
Dependencies are inferred from the claim text.