3D package structure and methods of forming same

A structure comprising:

• a first die, the first die having a first conductive pad and a passivation layer;
• an encapsulant around lateral edges of the first die;
• a first dielectric layer along top surfaces of the first die and the encapsulant;
• a first redistribution layer disposed over the first dielectric layer, the first redistribution layer comprising a first via extending through the first dielectric layer and contacting the first conductive pad;
• a second die over the first redistribution layer, the second die having a second conductive pad, a top surface of the first redistribution layer being interposed between a bottom surface of the second die and the first dielectric layer;
• a second dielectric layer disposed over a top surface of the second die;
• a second redistribution layer over the first redistribution layer and the second die, the second redistribution layer comprising a second via extending through the second dielectric layer and contacting the second conductive pad, the second redistribution layer further comprising a first level portion and a second level portion above an uppermost surface of the second dielectric layer, the second via and the second level portion comprising a continuous material;
• and
• a through via extending from a first seed layer of the first level portion of the second redistribution layer to the top surface of the first redistribution layer.

A structure comprising:

• a first die laterally spaced from a second die;
• a first dielectric layer laterally encapsulating the first die and the second die, a lower surface of the first dielectric layer being level with a lowermost point of the first die and a lowermost point of the second die, an upper surface of the first dielectric layer being level with an uppermost point of the first die and an uppermost point of the second die;
• a second dielectric layer over and along the upper surface of the first dielectric layer;
• a third die over the second dielectric layer;
• a third dielectric layer encapsulating the third die, a thickness of the third dielectric layer being greater than a thickness of the third die;
• a first redistribution layer extending from above a top surface of the second dielectric layer to a first conductive pad of the first die and to a second conductive pad of the second die;
• a first through via extending from a top surface of the third dielectric layer to the first redistribution layer;
• a second redistribution layer along the top surface of the third dielectric layer, the second redistribution layer comprising a second via extending to a third conductive pad of the third die;
• and
• conductive connectors attached to the second redistribution layer, the conductive connectors comprising a first conductive connector, a second conductive connector, and a third conductive connector, the first conductive connector being electrically connected to the first die, the second conductive connector being electrically connected to the second die, the third conductive connector being electrically connected to the third die.