Semiconductor packages

A semiconductor package, comprising:

• a substrate;
• one or more semiconductor chip structures on the substrate;
• a mold layer on the substrate and covering the one or more semiconductor chip structures;
• and
• a supporting structure contacting an upper surface of the mold layer, the supporting structure being distal from the upper surface of the substrate than the one or more semiconductor chip structures in a vertical direction that is perpendicular to the upper surface of the substrate,
• wherein the supporting structure includes a first supporting structure and a second supporting structure, the first supporting structure and the second supporting structure extending in parallel to each other and are spaced apart from each other,
• wherein each of the first supporting structure and the second supporting structure has a first bar shape or a first linear shape extending in a first horizontal direction that is parallel to the upper surface of the substrate,
• wherein a length of each of the first supporting structure and the second supporting structure in the first horizontal direction is a same length as a length of the mold layer in the first horizontal direction,
• wherein the supporting structure is embedded in the mold layer, and
• wherein an upper surface of the supporting structure in the vertical direction is coplanar with the upper surface of the mold layer in the vertical direction.

A semiconductor package, comprising:

• a substrate;
• a first semiconductor chip on the substrate and a second semiconductor chip on the substrate, the first semiconductor chip and the second semiconductor chip being spaced apart from each other in a first horizontal direction that is parallel to an upper surface of the substrate;
• a mold layer on the substrate, the mold layer covering both the first semiconductor chip and the second semiconductor chip;
• and
• a supporting structure overlapping both the first semiconductor chip and the second semiconductor chip in a vertical direction that is perpendicular to the upper surface of the substrate, the supporting structure being in direct contact with the mold layer,
• wherein the supporting structure includes a first supporting structure having a first length in the first horizontal direction and a second length in a second horizontal direction, the second length being less than the first length, the second horizontal direction being perpendicular to both the first horizontal direction and the vertical direction,
• wherein the second length of the first supporting structure in the second horizontal direction is equal to or greater than about 10 μM, and the second length of the first supporting structure in the second horizontal direction is equal to or less than one-half of a length of the substrate in the second horizontal direction,
• wherein the supporting structure further includes a second supporting structure that is parallel to the first supporting structure,
• wherein each of the first supporting structure and the second supporting structure has an inclined lateral surface,
• wherein each of the first supporting structure and the second supporting structure includes an upper surface having a first width in the second horizontal direction and a lower surface having a second width in the second horizontal direction, and
• wherein the second width is greater than the first width.