Back to results
US 12,009,340 B2Granted
Method for fabricating electronic package
AssigneeSiliconware Precision Industries Co., Ltd.
InventorsLung-Yuan Wang, Feng Kao, Mao-Hua Yeh
Life of this patent
Estimating the term…
Abstract
An electronic package and a method for fabricating the same are provided. Two packaging modules are stacked on each other. An area that an electronic package occupies a mother board is reduced during a subsequent process of fabricating an electronic product. Therefore, the electronic product has a reduced size.
Claims13
A method for fabricating an electronic package, comprising:
- providing a first carrying structure having a first surface and a second surface opposing the first surface, with at least one first electronic component disposed on the first surface and electrically connected to the first carrying structure, and a plurality of conductors disposed on the second surface and electrically connected to the first carrying structure;
- stacking on the first surface of the first carrying structure via at least one conductive element in a vertical direction a second carrying structure provided with a functional electronic component, wherein a lateral side surface of the functional electronic component faces and partially overlaps a lateral side surface of the first electronic component in a horizontal direction perpendicular to the vertical direction, and a top side surface of the functional electronic component does not face and overlap a top side surface of the first electronic component in the vertical direction;
- and
- forming a packaging layer between the first carrying structure and the second carrying structure, allowing the packaging layer to pack the first electronic component, the functional electronic component and the conductive element.
1 more element
Dependencies are inferred from the claim text.