Bonding tool and bonding method thereof

A method, comprising:

• receiving a bonding tool having a first surface and a bending member protruding from the first surface;
• causing a semiconductor die to deflect by contacting the bending member with the semiconductor die and applying a vacuum force to hold a periphery region of the semiconductor die;
• moving the semiconductor die toward a semiconductor wafer, wherein the semiconductor wafer has a flat surface facing the semiconductor die;
• contacting the semiconductor die with the semiconductor wafer while the semiconductor die is deflected and the semiconductor wafer is substantially flat, the contacting of the semiconductor die with the semiconductor wafer causing the bending member to retract toward the first surface;
• causing a full bonding between the semiconductor die and the semiconductor wafer while keeping the vacuum force to hole the semiconductor die at the same time;
• and
• releasing the semiconductor die from the bonding tool by removing the vacuum force subsequent to the full bonding.

A method, comprising:

• receiving a bonding tool comprising a bending member and a wafer chuck, wherein the wafer chuck comprises a trench and a plurality of vacuum holes, and the bending member is movably arranged in the trench and protrudes from a first surface of the bonding tool by a first distance;
• attaching a semiconductor die to the bonding tool by exerting a vacuum force through the plurality of vacuum holes, wherein the semiconductor die is deformed by a protrusion of bending member and the vacuum force from the bonding tool;
• contacting the semiconductor die to a semiconductor wafer while the semiconductor die is deflected and the semiconductor wafer is substantially flat to push the bending member into a retracted position, wherein the bending member in the retracted position protrudes from the first surface of the bonding tool by a second distance, wherein the second distance is less than the first distance;
• causing a full bonding between the semiconductor die and the semiconductor wafer while keeping the vacuum force to hold the semiconductor die at the same time;
• and
• releasing the semiconductor die from the bonding tool by removing the vacuum force subsequent to the full bonding.