Insulating paste-based conductive device and manufacturing method thereof

Abstract

Provided are an insulating paste-based conductive device and a manufacturing method thereof. The device comprises a first substrate and a second substrate arranged relative to the first substrate, and further comprises at least one first electrode disposed below the first substrate, a second electrode disposed on the second substrate and corresponding to the first electrode, and an insulating paste coating disposed on a contact surface between the first electrode and the second electrode, the insulating paste coating being electrically connected with the first electrode and the corresponding second electrode. The invention has good universality, such that the requirements of implementing or applying the art on a ceramic circuit board, a metal-based circuit board, an epoxy glass fiber circuit board, a flexible printed circuit board and a glass circuit board can be set, and an electronic circuit board without a packaging element on the circuit boards above can also be manufactured.

Dependencies are inferred from the claim text.