Semiconductor device
AssigneeShinko Electric Industries Co., Ltd.
InventorSatoshi Shiraki
Life of this patent
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Abstract
A semiconductor device includes a metal chip mounting member and a semiconductor chip bonded to the chip mounting member through a metal sintered material, wherein the metal sintered material includes a first portion overlapping the semiconductor chip in a plan view, and includes a second portion surrounding the semiconductor chip in the plan view, and wherein a porosity ratio of the first portion is greater than or equal to 1% and less than 15%, and a porosity ratio of the second portion is greater than or equal to 15% and less than or equal to 50%.
Claims18
A semiconductor device, comprising:
- a chip mounting member;
- and
- a semiconductor chip bonded to the chip mounting member through a metal sintered material,
- wherein the metal sintered material includes a first portion exactly overlapping the semiconductor chip in a plan view, and includes a second portion surrounding the first portion in the plan view, the first portion and the second portion being arranged next to each other without a gap therebetween,
- wherein a porosity ratio of the first portion is lower than a porosity ratio of the second portion, and
- wherein a thickness of the first portion is less than a thickness of any part of the second portion.
A method of making a semiconductor device, comprising:
- printing a paste of a metal sintered material at and around a chip mounting area of a chip mounting member;
- applying pressure to a periphery of the paste;
- and
- bonding a semiconductor chip to the chip mounting member through the metal sintered material by applying pressure to the paste situated within the chip mounting area through the semiconductor chip in a heated atmosphere to sinter the paste situated at and around the chip mounting area to form the metal sintered material,
- wherein the metal sintered material includes a first portion overlapping the semiconductor chip in a plan view, and includes a second portion surrounding the semiconductor chip in the plan view,
- wherein a porosity ratio of the first portion is lower than a porosity ratio of the second portion, and
- wherein a thickness of the first portion is less than a thickness of the second portion.
Dependencies are inferred from the claim text.