Integrated circuit packages having adhesion layers for through vias

A device comprising:

• a first integrated circuit die comprising a die connector;
• a first encapsulant around the first integrated circuit die;
• a first dielectric layer on the first encapsulant and the first integrated circuit die;
• a conductive feature comprising a metal layer having a lower via portion, a line portion, and an upper via portion, the lower via portion extending through the first dielectric layer to be connected to the die connector of the first integrated circuit die, the line portion extending along the first dielectric layer, the upper via portion disposed on the line portion, the upper via portion laterally offset from the lower via portion;
• a first adhesion layer extending along sidewalls of the line portion and the upper via portion of the conductive feature, a material of the first adhesion layer bonded to a material of the conductive feature;
• and
• a second encapsulant around the first adhesion layer, a material of the second encapsulant bonded to the material of the first adhesion layer.

A device comprising:

• a through via comprising a metal;
• an adhesion layer on the through via, the adhesion layer comprising an adhesive compound, the adhesive compound of the adhesion layer covalently bonded to the metal of the through via;
• an encapsulant around the adhesion layer, the encapsulant comprising an encapsulating material, the encapsulating material of the encapsulant covalently bonded to the adhesive compound of the adhesion layer;
• and
• a redistribution structure on the encapsulant, the redistribution structure comprising a redistribution line connected to the through via.