Manufacturing method of integrated substrate

A method comprising:

• forming a first redistribution structure comprising a fine redistribution circuitry over a first temporary carrier;
• forming a plurality of testing tips on a first surface of the fine redistribution circuitry of the first redistribution structure;
• transferring the plurality of testing tips and the first redistribution structure to a second temporary carrier provided with a temporary adhesive layer, wherein the plurality of testing tips are embedded in the temporary adhesive layer with the second temporary carrier disposed on the temporary adhesive layer;
• releasing the first temporary carrier to expose a second surface of the fine redistribution circuitry of the first redistribution structure;
• coupling a second redistribution structure comprising a coarse redistribution circuitry to the first redistribution structure through a plurality of conductive joints, wherein the plurality of conductive joints are formed on the second surface of the fine redistribution circuitry of the first redistribution structure;
• and
• releasing the second temporary carrier and the temporary adhesive layer from the plurality of testing tips and the first redistribution structure after coupling the second redistribution structure.