Interconnect loss of high density package with magnetic material

A package substrate, comprising:

• a first conductive layer in a first magnetic layer;
• a second magnetic layer over the first magnetic layer, wherein the first and second magnetic layers include a plurality of magnetic materials;
• a second conductive layer in the second magnetic layer, wherein the second conductive layer includes a plurality of first traces, and wherein the plurality of first traces are fully surrounded by the first and second magnetic layers;
• and
• a third conductive layer over the second magnetic layer, wherein the plurality of magnetic materials include manganese (Mn) ferrite materials, zinc (Zn) and Mn (Zn/Mn) ferrite materials, or nickel (Ni) and Zn (Ni/Zn) ferrite materials, wherein the plurality of magnetic materials include a plurality of material properties, and wherein the plurality of material properties include a low constant value, a magnetic tangent value, a frequency, a base filler chemistry, a filler shape, a filler orientation, a filler percentage, a loading fraction value, a permeability, an insertion loss, and a resin formulation, wherein the low constant value is approximately 2, wherein the base filler chemistry includes Mn ferrite, Zn/Mn ferrite, or Ni/Zn ferrite, wherein the filler percentage of the base filler chemistry is approximately 5% to 95%, wherein the magnetic tangent value is approximately 0.00 to 0.03, wherein the frequency is approximately 10 MHz to 50 MHz, wherein the filler shape includes a spherical type, a crushed type, or one or more types of specified shapes, and wherein the permeability is approximately 5 to 20.