Semiconductor package structure and method for manufacturing the same

A semiconductor package structure, comprising:

• a substrate;
• a semiconductor device disposed over the substrate;
• an encapsulant encapsulating the semiconductor device;
• a balance structure over the semiconductor device and contacting the encapsulant;
• and
• a warpage-resistant layer between the semiconductor device and the balance structure, wherein the warpage-resistance layer comprises a metal layer,
• wherein a surface roughness of an upper surface of the balance structure is greater than a surface roughness of a bottom surface of the balance structure.

A semiconductor package structure, comprising:

• a substrate;
• a semiconductor device disposed over the substrate;
• an encapsulant encapsulating the semiconductor device;
• a balance structure over the semiconductor device and contacting the encapsulant;
• and
• a warpage-resistant layer between the semiconductor device and the balance structure, wherein the warpage-resistance layer comprises a metal layer,
• wherein a surface roughness of an upper surface of the warpage-resistant layer is greater than a surface roughness of a bottom surface of the warpage-resistant layer.