A method of manufacturing a component carrier, the method comprising:
- forming a first component carrier structure comprising a first stack which comprises at least one first electrically conductive layer structure and at least one first electrically insulating layer structure, wherein the at least one first electrically conductive layer structure has a first contact element which extends up to a first contact surface of the first stack;
- filling at least one recess of the first contact element with an electrically conductive medium by filling through holes of a dielectric sheet directly connected to the first contact element at the first contact surface, the at least one recess comprising a larger dimensioned cavity delimited by a smaller dimensioned surface profile traversing a via;
- forming a second component carrier structure comprising a second stack which comprises at least one second electrically conductive layer structure and at least one second electrically insulating layer structure, wherein the at least one second electrically conductive layer structure has a second contact element which extends to a respective contact surface of the second stack;
- and
- connecting the first contact element at the first contact surface with the second contact element at the second contact surface by filling the at least one recess of the first contact element and optionally of the second contact element with the electrically conductive connection medium;
- wherein the at least one recess of the first contact element is aligned with at least one recess of the second contact element, the at least one recess of the second contact element comprising a respective larger dimensioned cavity delimited by a respective smaller dimensioned surface profile traversing the at least one recess of the second contact element across the through hole,
- wherein the at least one recess of the first contact element and the at least one recess of the second contact element confine the electrically conductive connection medium such that the first contact element and the second contact element connect the first contact surface of the first stack with the second contact surface of the second stack with the electrically conductive medium at least partially therebetween.