Semiconductor device and method of compartment shielding using bond wires

A method of making a semiconductor device, comprising:

• providing a substrate;
• disposing a bond wire on the substrate;
• disposing an electrical component over the substrate, wherein the bond wire extends over the electrical component and a distal end of the bond wire returns to contact the substrate;
• depositing an encapsulant over the substrate and bond wire;
• forming an opening in the encapsulant extending to the bond wire;
• and
• disposing a conductive material in the opening.

A semiconductor device, comprising:

• a substrate;
• a bond wire disposed on the substrate;
• an electrical component disposed over the substrate, wherein the bond wire loops over the electrical component with a distal end of the bond wire returning to contact the substrate;
• an encapsulant deposited over the substrate and bond wire with an opening in the encapsulant extending below a surface of the encapsulant to a mid-portion of the bond wire;
• and
• a conductive material deposited in the opening to contact the mid-portion of the bond wire.

A semiconductor device, comprising:

• a substrate;
• a bond wire disposed on the substrate;
• an electrical component disposed over the substrate, wherein the bond wire extends over the electrical component and returns to contact the substrate;
• an encapsulant deposited over the substrate and bond wire with an opening in the encapsulant extending to the bond wire;
• and
• a conductive material disposed in the opening.

A semiconductor device, comprising:

• a substrate;
• a bond wire disposed on the substrate;
• an electrical component disposed over the substrate, wherein the bond wire loops over the electrical component with a distal end of the bond wire returning to contact the substrate;
• an encapsulant deposited over the substrate and bond wire with an opening in the encapsulant extending to the bond wire;
• and
• a conductive material disposed in the opening and contacting the bond wire.