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US 12,009,312 B2Granted
Semiconductor device package
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsChanyuan Liu, Kuo-Hsien Liao, Yu-Hsiang Sun
Life of this patent
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Abstract
A semiconductor device package and a fabrication method thereof are disclosed. The semiconductor package comprises: a substrate having a first face and an opposing second face, wherein the first face is mounted with a first semiconductor component and a plurality of connectors; and a first shielding member covering the first semiconductor component and a first group of the plurality of connectors, while exposing a second group of the plurality of connectors.
Claims17
A semiconductor package, comprising:
- a substrate having a first face and an opposing second face, wherein the first face is mounted with a first semiconductor component and a plurality of connectors;
- and
- a first shielding member covering the first semiconductor component and a first group of the plurality of connectors, while exposing a second group of the plurality of connectors,
- wherein the first semiconductor component is in physical contact with the first shielding member.
1 more element
A semiconductor device, comprising:
- a circuit board having a plurality of conductive pads arranged on a mounting face thereof and
- a semiconductor package mounted over the circuit board, the semiconductor package comprising:
- a substrate having a first face arranged toward the mounting face of the circuit board, wherein the first face is mounted with a first semiconductor component and a plurality of connectors;
- a first shielding member extending between one of the plurality of conductive pads and one of the plurality of connectors;
- a first molding member encapsulating a second face opposite to the first face;
- and
- a second shielding member covering the second molding member, wherein the first shielding member and the second shielding member are physically separated.
4 more elements
An electronic package,
- an electronic component;
- a plurality of electrical contacts configured to connect the electronic package to an external electronic device;
- and
- a shielding element configured to shield the electronic component from electromagnetic interference;
- wherein a first group of the electrical contacts is electrically connected to the shielding element and a second group of the electrical contacts is electrically dis-connected with the shielding element,
- wherein a bottom profile of the second group of the electrical contacts protrudingly exposes from the shielding element.
3 more elements
Dependencies are inferred from the claim text.