Semiconductor device

A semiconductor device, comprising:

• a substrate including an insulating plate and a conductive plate disposed on a front surface of the insulating plate, the conductive plate having a first chip area, a second chip area and a terminal area in the front surface of the conductive plate;
• a first semiconductor chip disposed in the first chip area on the front surface of the conductive plate;
• a second semiconductor chip disposed in the second chip area on the front surface of the conductive plate;
• and
• a wiring terminal disposed in the terminal area on the front surface of the conductive plate,
• wherein the conductive plate includes, on the front surface thereof, a first slit extending in a space between the first chip area and the second chip area, a second slit extending in a space between the first chip area and the terminal area, and a third slit extending in a space between the second chip area and the terminal area, and
• wherein the first slit is provided as one continuous slit that penetrates completely through the conductive plate in a thickness direction orthogonal to direction of the front surface of the conductive plate and reaches the insulating plate, and one of the second slit and the third slit is provided as either one continuous slit that does not penetrate through the conductive plate in the thickness direction or a plurality of slits forming a broken line pattern, each of the plurality of slits penetrating completely through the conductive plate in the thickness direction and reaching the insulating plate.