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US 12,009,286 B2Granted
Methods of forming packaged semiconductor devices and leadframes for semiconductor device packages
AssigneeMACOM Technology Solutions Holdings, Inc.
InventorsSoon Lee Liew, Eng Wah Woo, Alexander Komposch
Life of this patent
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Abstract
A method of forming a packaged semiconductor device according to some embodiments includes providing a leadframe blank including a first package blank, a second package blank and a tie bar between the first package blank and the second package blank, forming a recessed cavity in the tie bar, and separating the first and second package blanks by sawing through the leadframe blank along the tie bar.
Claims15
A method of forming a packaged semiconductor device, comprising:
- providing a leadframe blank including a first package blank, a second package blank and a tie bar between the first package blank and the second package blank, each package blank comprising a die attach pad and a lead, wherein the leads of the first and second package blanks are attached to the tie bar;
- forming a recessed cavity in the tie bar;
- and
- separating the first and second package blanks along the tie bar,
- wherein each package blank comprises a plurality of leads attached to the tie bar at respective attachment points, the method further comprising forming a plurality of recessed cavities in the tie bar at the attachment points.
2 more elements
A method of forming a packaged semiconductor device, comprising:
- providing a leadframe blank including a first package blank, a second package blank and a tie bar between the first package blank and the second package blank;
- forming a recessed cavity in the tie bar;
- and
- separating the first and second package blanks along the tie bar,
- wherein separating the first and second package blanks along the tie bar comprises sawing through the leadframe blank along the tie bar.
2 more elements
Dependencies are inferred from the claim text.