Substrate having a recessed portion for an electronic component

A package for housing an electronic component comprising:

• an insulating substrate comprising:
• a first surface comprising a recessed portion in which an electronic component is mounted;
• and
• a second surface located on an opposite side to the first surface;
• an external connection conductor located on the second surface;
• internal wiring located inside the insulating substrate;
• first wiring located on the second surface and connected to the internal wiring;
• and
• second wiring located between the first wiring and the external connection conductor and connected to the external connection conductor,
• wherein
• the insulating substrate includes:
• a base portion having the second surface;
• and
• a frame portion having the first surface and located on the base portion,
• the first wiring, the second wiring, and the external connection conductor are a continuous conductor,
• the first wiring and the second wiring are covered with an insulating layer,
• the second wiring is located so as to overlap the frame portion in a perspective plan view and is configured to be electrically independent of the first wiring by being partially cut.